Chip structure with redistribution Circuit, chip package and manufacturing process thereof

ABSTRACT

A semiconductor chip or wafer comprises a passivation layer and a circuit line. The passivation layer comprises an inorganic layer. The circuit line is over and in touch with the inorganic layer of the passivation layer, wherein the circuit line comprises a first contact point connected to only one second contact point exposed by an opening in the passivation layer, and the positions of the first contact point and the only one second contact point from a top view are different, and the first contact point is used to be wirebonded thereto.

This application is a Continuation-in-part of application Ser. No. 10/434,524, filed on May 8, 2003, and a Continuation-in-part of application Ser. No. 10/434,142, filed on May 8, 2003.

RELATED PATENT APPLICATION

This application is related to U.S. Pat. No. 5,384,488, U.S. Pat. No. 5,969,424, U.S. Pat. No. 6,187,680, U.S. Pat. No. 6,229,221, U.S. Pat. No. 6,593,649 and TW Patent No. 594,953, which are herein incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a semiconductor chip, chip package and process for forming the same. More particularly, this invention relates to a semiconductor chip, chip package and process for forming the same, wherein wirebonds are suited to being wirebonded to redistribution circuit lines on the semiconductor chip.

2. Description of the Related Art

In recent years, the application of semiconductor in our life has increased with the the exuberant electronics industry. As a result, a number of semiconductor manufacturing techniques are also developing rapidly. A typical semiconductor IC manufacturing process can be largely divided into two stages; the first stage is associated with the manufacturing of semiconductor IC chip, which generally comprises the steps of growing silicon singe-crystals, depositing epitaxial layer of Si, manufacturing electronic devices, such as transistors, metal oxide semiconductors (MOS) or passive devices, and manufacturing metal interconnections, . . . etc. The second stage is the packaging process. The purpose of the packaging process is to prevent the IC chips from reaching the outside atmosphere and moisture. What is more, a finished chip package must also be electrically connected to the external circuitry.

In general, a typical electrical connection for a chip package can be processed by a wire-bonding process, a tape automatic bonding (TAB) process, or a flip chip (FC) process. Of these three kinds, the industrial infrastructure for wirebonding is the most mature one, and it has been widely used by various kinds of electronic packages today. In the wire-bonding process, the connection points of a carrier, which can be either a holding substrate or a lead frame, and a chip are joined with a wire electrically connecting the carrier and the chip such that electrical signals can be transmited/received to/from an external circuitry. Typically, the connection points of the carrier and the corresponding ones on the chip are not placed far apart to make the wire-bonding process simple and to prevent the bonded wires from winding. However, in cases that the layout of the connection points on the carrier is changed or that the chips and carriers are produced by different companies, the wire-bonding process can become less straightforward. Moreover, the electrical properties reduce in that elongated wirebonding wires are used to connect the chip and carrier. As a result, signals transmitted from the chip may be attenuated because of the longer conduction path used to connect the chip and the carrier. Moreover, the strength of the bonding wire becomes a serious issue. For solving the above problem, a redistribution routing can be made to alter the layout of the chip, which leads the chip suitable for being wirebonded thereto. It is worthy of note that the wire-bonding process requires a sufficient loading force to assure the connectivity between the wire and the pad is reliable. Attributed to this process, the elements under the bonding pad will be subjected to an undesired shock during the wire bonding process. Thus, the delicate electronic devices, such as transistors, MOS or passive devices, are typically not to be placed under the wirebond pad to avoid any potential damage caused by such an effect.

R.O.C. patent application Serial No. 90100339, now Patent No. 594,953, teaches the methods and structures of a chip structure with redistribution lines and a process for the same.

FIG. 1 is a cross-sectional view showing a semiconductor chip suited for being wirebonded thereto according to R.O.C. patent application Serial No. 90100339. Referring to FIG. 1, a chip structure 100 is shown with a semiconductor substrate 110, insulation layers 125 s, 125 b and 125 c, metal layers 135 a and 135 b, a redistribution metal layer 160, a pad 140, a passivation layer 145, an elastomer layer 150, a top polymer layer 190, and a wirebonded wire 200. Multiple IC devices 115 are formed in or on the semiconductor substrate 110, with a trench 120 incorporated in the semiconductor substrate 110 and between the IC devices 115. Furthermore, the insulation layers 125 a, 125 b, and 125 c are formed over the semiconductor substrate 110. The metal layers 135 a and 135 b and pad 140 are respectively formed on the insulation layers 125 a, 125 b and 125 c. The metal layers 135 a and 135 b and pad 140 are electrically connected to the IC devices 115 through metal vias 130 a 130 b, and 130 c.

Referring to FIG. 1, the passivation layer 145 and elastomer layer 150 are formed over the insulation layer 125 c. An opening 155 in the passivation layer 145 and elastomer layer 150 exposes the pad 30. The redistribution metal layer 160 extends into the opening 155 and on the elastomer layer 150. The top polymide (PI) layer 190 covers the elastomer layer 150 and the redistribution metal layer 160. An opening 195 is in the top polymer layer 190 and exposes the redistribution metal layer 160. The wirebonded wire 200 is bonded on the redistribution metal layer 160 exposed by the opening 195 in the redistribution metal layer 160.

The elastomer layer 150 may be polyimide or elastic rubber, which can be prevented from being damaged due to the wirebonding process. However, the above process is costly because the elastomer layer 150 between the redistribution metal layer 160 and the passivation layer 140 should be made.

SUMMARY OF THE INVENTION

The objective of the invention is to provide a semiconductor chip with redistribution trace, which can be formed over and in touch with a passivation layer and the circuits under the wirebond pad of the redistribution traces can be prevented from being damaged due to the wirebonding process.

In order to reach the above objectives, the present invention provides a semiconductor chip or wafer comprises a passivation layer and a circuit line. The passivation layer comprises an inorganic layer. The circuit line is over and in touch with the inorganic layer of the passivation layer, wherein the circuit line comprises a first contact point connected to only one second contact point exposed by an opening in the passivation layer, and the positions of the first contact point and the only one second contact point from a top view are different, and the first contact point is used to be wirebonded thereto.

In a case, the circuit line may comprise a metal layer having a thickness greater than 1 μm and comprising gold with greater than 90.

In another case, the circuit line may comprise a metal layer having a thickness greater than 1 μm and comprising silver with greater than 90.

In another case, the circuit line may comprise a metal layer having a thickness greater than 1 μm and comprising copper with greater than 90.

In another case, the circuit line may comprise a metal layer having a thickness greater than 1 μm and comprising platinum with greater than 90.

In another case, the circuit line may comprise a metal layer having a thickness greater than 1 μm and comprising palladium with greater than 90.

In another case, the circuit line may comprise a metal layer having a thickness greater than 1 μm and comprising rhodium with greater than 90.

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated as a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a semiconductor chip suited for being wirebonded thereto according to R.O.C. patent application Serial No. 90100339.

FIG. 2A is a cross-sectional view showing a semiconductor chip according to an embodiment of the invention.

FIG. 2B is a cross-sectional view showing a semiconductor chip suited for being wirebonded thereto according to another embodiment of the invention.

FIG. 3A is a cross-sectional view showing the invented semiconductor chip applied to a BGA package according to an embodiment of the present invention. FIG. 3B is a top view showing the same.

FIGS. 3C and 3D are top views showing semiconductor chips applied to a BGA package according to other embodiments of the invention.

FIG. 4A is a cross-sectional view showing the invented semiconductor chip applied to a TSOP package according to an embodiment of the present invention. FIG. 4B is a top view showing the same.

FIG. 5 is a cross-sectional view showing the invented semiconductor chip applied to a SOJ package according to an embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring now to FIG. 2A, which is a cross-sectional view showing a semiconductor chip according to an embodiment of the invention. In FIG. 2A, electronic devices 312, such as MOS devices, transistors, or passive devices, are formed in and on the semiconductor substrate 310. Multiple dielectric layers 322 a, 322 b and 322 c are formed over the semiconductor substrate 310. Multiple circuit layers 324 a, 324 b and 324 c are formed on the dielectric layers 322 a, 322 b and 322 c, respectively. The circuit layers 324 a, 324 b and 324 c can be connected to each other and connected to the electrical devices 312 through multiple metal vias 326. The circuit layers 324 a, 324 b and 324 c may include aluminum, an aluminum-copper alloy or an aluminum-silicon alloy formed by a sputter process. Alternatively, the circuit layers 324 a, 324 b and 324 c may include copper formed by a damascene process.

Referring to FIG. 2A, a passivation layer 330 is formed over the dielectric layers 322 a, 322 b and 322 c. The topmost circuit layer 324 c includes a first contact point 340 exposed through an opening 330 a in the passivation layer 330. The thickness s of the insulation layer 330 may be greater than 0.35 μm, and may be composed of a silicon-oxide layer, a silicon-nitride layer, a phosphosilicate glass (PSG) layer, or a composite structure comprising the above-mentioned layers. The passivation layer 330 comprises one or more insulating layers, such as silicon-nitride layer or silicon-oxide layer, formed by CVD processes. In a case, a silicon-nitride layer with a thickness of between 0.2 and 1.2 μm is formed over a silicon-oxide layer with a thickness of between 0.1 and 0.8 μm. Generally, the passivation layer 330 comprises a topmost silicon-nitride layer or a topmost silicon-nitride layer in the finished chip structure. The passivation layer 330 comprises a topmost CVD insulating layer in the finished chip structure. The passivation layer 330 prevents the penetration of mobile ions, such as sodium ions, moisture, transition metals, such as gold, silver, copper, and so on, and other contaminations. The passivation layer 330 is used to protect the underlying devices, such as transistors, MOS devices, polysilicon resistors, poly-to-poly capacitors, and fine-line metal interconnections.

Referring to FIG. 2A, a redistribution layer 350 is formed over and in touch with the passivation layer 330 and connected to the connection point 340. For example, the redistribution layer 350 is formed over and in touch with the above-mentioned nitride layer of the passivation layer 330. From a top view, the redistribution layer 350 includes a second contact point 356 having a different position from that of the first contact point 340 of the circuit layer 324 c. A wirebonded wire 360 can be bonded on the second contact point 356. The redistribution layer 350 may be composed of an adhesion/barrier layer 354 and a bulk metal layer 352, the bulk metal layer 352 being electroplated on the adhesion/barrier layer 354. The adhesion/barrier layer 354 may comprise chromium, a chromium-copper alloy, titanium, a titanium-tungsten alloy, titanium nitride, tantalum or tantalum nitride, for example. The bulk metal layer 352 may be a single metal layer and may have a thickness a1 thicker than 1 μm, and preferably between 2 μm and 30 μm, wherein the bulk metal layer 312 may comprise gold with greater than 90 weight percent, and, preferably, greater than 97 weight percent. Alternatively, a seed layer (unshown), such as gold, can be sputtered on the adhesion/barrier layer 354, preferably comprising a titanium-tungsten alloy, and then the bulk metal layer 312 is electroplated on the seed layer.

In another case, the bulk metal layer 352 may be a single metal layer and may have a thickness a1 thicker than 1 μm, and preferably between 2 μm and 30 μm, wherein the bulk metal layer 352 may comprise silver with greater than 90 weight percent, and, preferably, greater than 97 weight percent. Alternatively, a seed layer (unshown), such as silver, can be sputtered on the adhesion/barrier layer 354 and then the bulk metal layer 352 is electroplated on the seed layer, wherein the adhesion/barrier layer 354 may comprise chromium, a chromium-copper alloy, titanium, a titanium-tungsten alloy, titanium nitride, tantalum or tantalum nitride, for example.

In another case, the bulk metal layer 352 may be a single metal layer and may have a thickness a1 thicker than 1 μm, and preferably between 2 μm and 30 μm, wherein the bulk metal layer 352 may comprise copper with greater than 90 weight percent, and, preferably, greater than 97 weight percent. Alternatively, a seed layer (unshown), such as copper, can be sputtered on the adhesion/barrier layer 354, preferably comprising titanium, chromium or a chromium-copper alloy, and then the bulk metal layer 352 is electroplated on the seed layer, wherein the adhesion/barrier layer 354 may comprise other materials, such as a titanium-tungsten alloy, titanium nitride, tantalum or tantalum nitride, for example. Alternatively, the adhesion/barrier layer 354 may be formed by sputtering a chromium layer and then sputtering a chromium-copper layer on the chromium layer.

In another case, the bulk metal layer 352 may be a single metal layer and may have a thickness a1 thicker than 1 μm, and preferably between 2 μm and 30 μm, wherein the bulk metal layer 352 may comprise platinum with greater than 90 weight percent, and, preferably, greater than 97 weight percent. Alternatively, a seed layer (unshown), such as platinum, can be sputtered on the adhesion/barrier layer 354 and then the bulk metal layer 352 is electroplated on the seed layer, wherein the adhesion/barrier layer 354 may comprise chromium, a chromium-copper alloy, titanium, a titanium-tungsten alloy, titanium nitride, tantalum or tantalum nitride, for example.

In another case, the bulk metal layer 352 may be a single metal layer and may have a thickness a1 thicker than 1 μm, and preferably between 2 μm and 30 μm, wherein the bulk metal layer 352 may comprise palladium with greater than 90 weight percent, and, preferably, greater than 97 weight percent. Alternatively, a seed layer (unshown), such as palladium, can be sputtered on the adhesion/barrier layer 354 and then the bulk metal layer 352 is electroplated on the seed layer, wherein the adhesion/barrier layer 354 may comprise chromium, a chromium-copper alloy, titanium, a titanium-tungsten alloy, titanium nitride, tantalum or tantalum nitride, for example.

In another case, the bulk metal layer 352 may be a single metal layer and may have a thickness a1 thicker than 1 μm, and preferably between 2 μm and 30 μm, wherein the bulk metal layer 352 may comprise rhodium with greater than 90 weight percent, and, preferably, greater than 97 weight percent. Alternatively, a seed layer (unshown), such as rhodium, can be sputtered on the adhesion/barrier layer 354 and then the bulk metal layer 352 is electroplated on the seed layer, wherein the adhesion/barrier layer 354 may comprise chromium, a chromium-copper alloy, titanium, a titanium-tungsten alloy, titanium nitride, tantalum or tantalum nitride, for example.

In another case, the adhesion/barrier layer 354 may comprise titanium, a titanium-tungsten alloy, titanium nitride, tantalum or tantalum nitride, for example. Alternatively, the adhesion/barrier layer 354 may be formed by sputtering a chromium layer and then sputtering a chromium-copper layer on the chromium layer. The bulk metal layer 352 may be multiple metal layers, such as first and second metal layers, the second metal layer being on the first metal layer. The first metal layer may have a thickness a2 thicker than 1 μm, and preferably between 2 μm and 30 μm, wherein the first metal layer 352 may comprise copper with greater than 90 weight percent, and, preferably, greater than 97 weight percent. The second metal layer may comprise nickel, for example, and may have a thickness thicker than 1 μm, and preferably between 2 μm and 5 μm. Alternatively, a seed layer (unshown), such as copper, can be sputtered on the addhesion/barrier layer 331, then the first metal layer is electroplated on the seed layer, and then the second metal layer is electroplated on the first metal layer.

In another case, the adhesion/barrier layer 354 may comprise titanium, a titanium-tungsten alloy, titanium nitride, tantalum or tantalum nitride, for example. Alternatively, the adhesion/barrier layer 354 may be formed by sputtering a chromium layer and then sputtering a chromium-copper layer on the chromium layer. The bulk metal layer 352 may be multiple metal layers, such as first, second and third metal layers, the second metal layer being on the first metal layer, and the third metal layer being on the second metal layer. The first metal layer may have a thickness a2 thicker than 1 μm, and preferably between 2 μm and 30 μm, wherein the first metal layer 352 may comprise copper with greater than 90 weight percent, and, preferably, greater than 97 weight percent. The second metal layer may comprise nickel, for example, and may have a thickness thicker than 1 μm, and preferably between 2 μm and 5 μm. The third metal layer may be made of gold, for example, and may have a thickness thicker than 100 angstroms, and preferably between 1 μm and 1000 angstroms. Alternatively, a seed layer (unshown), such as copper, can be sputtered on the addhesion/barrier layer 331, then the first metal layer is electroplated on the seed layer, and then the second metal layer is electroplated on the first metal layer.

The above-mentioned adhesion/barrier layer 354 and bulk metal layer 352 is formed on a semiconductor wafer before the semiconductor wafer is divided into multiple semiconductor chips 300 shown in FIG. 2A. After the semiconductor wafer is divided into multiple semiconductor chips 300, the wirebond wire 200 can be bonded on the bulk metal layer 352 for connecting the semiconductor chip 300 to another chip or a substrate, such as a printed circuit board.

FIG. 2B is a cross-sectional view showing a semiconductor chip suited for being wirebonded thereto according to another embodiment of the invention. Optionally, as shown in FIG. 2B, an encapsulating layer 360 can be deposited on the redistribution circuit layer 350 and the passivation layer 330 using a spin-coating process. An opening 360 a in the encapsulating layer 360 exposes the second connection point 356. The wirebond wier 200 can be bonded on the redistribution circuit layer 350 through the opening 360 a in the encapsulating layer 360. The thickness d of the encapsulating layer 36 may be thicker than 1 μm, and, preferably, between 2 μm and 15 μm. The encapsulating layer 360 may be made of polymer, such as polyimide (PI), benzocyclobutene (BCB), porous dielectric material, paralene, epoxy, or elastomer.

Referring to FIGS. 2A and 2B, the second contact point 356 formed over the electronic devices 312, such as MOS devices, transistors, or passive devices, can be used to be wirebonded thereto. There is relatively much space over the passivation layer 330 that can be employed to be wirebonded thereto. As compared to the conventional art that does not allow IC I/O pads to be placed over the active devices, this invention allows a greater flexibility for the locating of the redistributed wirebond point 356.

Moreover, the redistribution layer 350 allows the semiconductor chip 300 applied to various kinds of packaging structures. For example, the redistribution layer 350 may allow the semiconductor chip 300 to be electrically connected to a leadframe, a flexible substrate or a printed circuit board. Besides, even without the use of an elastomer layer used in the admitted prior art, the wirebond wire 200 can still be bonded on the redistribution metal layer 350 over the electronic devices 312, and the negative impact on the electronic devices 312 during a wirebonding process can be avoided. The invented chip structure 300 removes the need for the elastomor layer, so the fabrication of the semiconductor chip 300 is economic and time-saving.

The above-mentioned semiconductor chip 300 may be applied for various chip packages employing a wirebonding process, such as BGA package, TSOP package or SOJ package, affiliated with the redistribution metal layer 350.

FIG. 3A is a cross-sectional view showing the invented semiconductor chip applied to a BGA package according to an embodiment of the present invention. FIG. 3B is a top view showing the same. In reference to FIG. 3A, the semiconductor chip 300 is mounted on a top surface of a printed circuit board or substrate 410. The wirebond wires 200 connect wirebond pads 356 of the redistribution metal layer 350 on the semiconductor chip 300 to the other wierbond pads 412 on the printed circuit board 410. A packaging polymer structure 420 covers the semiconductor chip 300 and the wirebond wires 200. Multiple solder balls 430 are formed under a bottom surface of the printed circuit board 410 to connect the printed circuit board 410 to an external circuitry component (unshown).

In reference to FIG. 3A and FIG. 3B, the substrate 410 has multiple third connection points 412 a, 412 b, 412 c, 412 d, 412 e, 412 f, 412 g, 412 h, 412 i and 412 j exposed by openings in the passivation layer; the semiconductor chip 300 has multiple first connection points 340 a, 340 b, 340 c, 340 d, 340 e, 340 f, 340 g, 340 h, 340 i and 340 j; the redistribution metal layer 350 have multiple second connection points 356 a, 356 b, 356 c, 356 d, 356 e, 356 f, 356 g, 356 h, 356 i and 356 j. Multiple rerouting lines of the redistribution layer 350 connect the first connection points 340 a, 340 b, 340 c, 340 d, 340 e, 340 f, 340 g, 340 h, 340 i and 340 j to the second connection points 356 a, 356 b, 356 c, 356 d, 356 e, 356 f, 356 g, 356 h, 356 i and 356 j respectively, with the positions, sequence or pin assignment of the first connection point, such as 340 a, and the second connection point, such as 356 a, from a to view being different. The wirebonded wires 200 connect the second connection points 356 a, 356 b, 356 c, 356 d, 356 e, 356 f, 356 g, 356 h, 356 i and 356 j to the third connection points 412 a, 412 b, 412 c, 412 d, 412 e, 412 f, 412 g, 412 h, 412 i and 412 j.

In another situation where the redistribution metal layer 350 is unformed, Multiple wirebonded wires also can connect the first connection points 340 a, 340 b, 340 c, 340 d, 340 e, 340 f, 340 g, 340 i and 340 j to the third connection points 412 j, 412 h, 412 g, 412 f, 412 d, 412 e, 412 c, 412 i, 412 b and 412 a, respectively.

As described above, the pin assignment or sequence of the first connection points 340 a-340 f differ from that of the second connection point 356 a-356 f. As described above, the pin assignment of the third connection points connected to the first connection points, original IC pads, may be different from that of the third connection points connected to the second connection points, redistributed pads.

It is worth mentioning that the first and second connection points are not limited to one-to-one manner. FIG. 3C is a top view showing a semiconductor chip applied to a BGA package according to another embodiment of the invention. The first connection point alone can be connected to more than one second connection points through the redistribution metal layers. For example, in reference to FIG. 3C, the first connection point 340 b can be connected to two second connection points 356 ba and 356 bb. The wirebond wires 200 can connect the two second connection points 356 ba and 356 bb to the third connection points 412 ba, 412 bb.

However, the invention is not just limited to such applications. FIG. 3D is a schematic top showing a semiconductor chip applied to a BGA package according to another embodiment of the invention. A rerouting line can connect multiple first connection points to a single second connection point. For example, in reference to FIG. 3D, the multiple first connection points 340 a, 340 b and 340 c are connected to the single second connection point 356 a via the rerouting line of the redistribution metal layer. The wirebonded wire 200 connects the second connection point 356 a to the third connection point 412 a.

FIG. 4A is a cross-sectional view showing the invented semiconductor chip applied to a TSOP package according to an embodiment of the present invention. FIG. 4B is a top view showing the same. Referring to FIG. 4A, the semiconductor chip 300 with a redistribution metal layer 350 is mounted on a die pad 512 of a lead frame 510. Multiple wirebond wires 200 connect the redistribution metal layer 350 of the semiconductor chip 300 to multiple leads 514 of the lead frame 510. A packaging polymer structure 520 encapsulates the semiconductor chip 300, the wirebond wires 200 and the die pad 512. The leads 514 of the TSOP chip package's lead frame 510 are bent in a Gull Wing fashion.

Referring to FIG. 4A and FIG. 4B, multiple rerouting lines of the redistribution metal layer 350 connect the first connection points 340 a, 340 b, 340 c, 340 d, 340 e, 340 f, 340 g, 340 h, 340 i and 340 j to the second connection points 356 a, 356 b, 356 c, 356 d, 356 e, 356 f, 356 g, 356 h, 356 i and 356 j respectively, with the positions, sequence or pin assignment of the first connection point, such as 340 a, and the second connection point, such as 356 a, from a to view being different. Multiple wirebond wires connects the second connection points 356 a, 356 b, 356 c, 356 d, 356 e, 356 f, 356 g, 356 h, 356 i and 356 j to the third connection points of the leads 514 a, 514 b, 514 c, 514 d, 514 e, 514 f, 514 g, 514 h, 514 i and 514 j respectively.

In another situation where the redistribution metal layer 350 is unformed. Multiple wirebonded wires also can connect the first connection points 340 a, 340 b, 340 c, 340 d, 340 e, 340 f, 340 g, 340 i and 340 j to the above-mentioned printed circuit board 410 for fabricating a BGA package. However, if the redistribution metal layer 350 is formed on the passivation layer of the semiconductor chip, the second connection points 356 a, 356 b, 356 c, 356 d, 356 e, 356 f, 356 g, 356 h, 356 i and 356 j of the redistribution metal layer 350 can be connected to the third connection points of the leads 514 a, 514 b, 514 c, 514 d, 514 e, 514 f, 514 g, 514 h, 514 i and 514 j respectively, as shown in FIG. 4B. As described above, the circuitry component, such as printed circuit board, adapted to be connected to the first connection points 340 a, 340 b, 340 c, 340 d, 340 e, 340 f, 340 g, 340 i and 340 j may be different from the circuitry component, such as lead frame, adapted to be connected to the second connection points 356 a, 356 b, 356 c, 356 d, 356 e, 356 f, 356 g, 356 h, 356 i and 356 j.

Besides its use in TSOP chip packages, the redistribution lines of the invention allows its use in SOJ packages, described as follows. FIG. 5 is a cross-sectional view showing the invented semiconductor chip applied to a SOJ package according to an embodiment of the present invention. As shown in FIG. 5, the semiconductor chip 300 is mounted on a die pad 612 of a lead frame 610, with multiple wirebond wire 200 connecting the redistributed connection point 356 of the redistribution metal layer 350 on the passivation layer of the semiconductor chip 300 to multiple leads 614 of the lead frame 610. A packaging polymer structure 620 encapsulates the semiconductor chip 300, the wirebond wires 200 and the die pad 612. The leads 614 of the SOJ chip package's lead frame 610 are bent in a J-lead fashion.

Furthermore, the semiconductor chip having the features shown in FIGS. 3C and 3D can also be utilized in chip packages with lead frames, such as TSOP or SOJ packages.

A detailed description of manufacturing the above semiconductor chip 300, BGA chip package, TSOP chip package, and SOJ chip package is in the following paragraphs.

First, referring to FIGS. 2A and 2B, a semiconductor wafer 300 with a passivation layer 330 and at least one original IC connection point 340 is provided. At least one first opening 330 a in the passivation layer 330 exposes the original IC connection point 340. Second, the redistribution metal layer 350 is formed over and in touch with the passivation layer 330 and connected to the original IC connection point 340. The redistribution metal layer 350 has at least one redistributed connection point 356, wherein the position, sequence, or pin assignment of the redistributed connection point 356 from a top view is different from that of original IC connection point 340.

Optionally, an encapsulating polymer layer 360 can be spin-coated on the redistribution metal layer 350. An opening 360 a in the encapsulating polymer layer 360 exposes the redistributed connection point 356, as shown in FIG. 2B. Next, the semiconductor wafer is divided into multiple semiconductor chips using a cutting process. Next, a wire-bonding process is performed to form a wirebond wire 200 connecting the redistributed connection point 356 to the connection point on a circuitry component, such as printed circuit board or lead frame, as shown in FIGS. 3A, 4A, and 5. The layout of the second connection point 346 allows the semiconductor chip 300 to be used in various chip packages, such as BGA chip package, TSOP chip package or SOJ chip package.

The redistribution metal layer 350 can be deposited by sputtering an adhesion/barrier layer 354 on a whole top surface of a semiconductor wafer, then sputtering an seed layer on the adhesion/barrier layer 354, then optionally forming a patterned photoresist mask on the seed layer, the seed layer or adhesion/barrier layer 354 being exposed through an opening having trace pattern in the patterned photoresist mask, then electroplating the bulk metal layer 352 on the seed layer or adhesion/barrier layer 354 exposed by the opening in the patterned photoresist mask, then striping the the patterned photoresist mask, and then removing the seed layer and adhesion/barrier layer 354 not covered by the bulk metal layer 352. The details of the adhesion/barrier layer 354, seed layer and bulk metal layer can be referred to the above-mentioned.

As shown in FIG. 3A showing a BGA chip package, after the semiconductor wafer is divided into multiple semiconductor chips, the semiconductor chip 300 is mounted on a top surface of a printed circuit board or substrate 410. Next, multiple wirebond wires 200 are formed to connect wirebond pads 356 of the redistribution metal layer 350 on the semiconductor chip 300 to the orher wierbond pads 412 on the printed circuit board 410. Next, a packaging polymer structure 420 is formed to cover the semiconductor chip 300 and the wirebond wires 200. Next, multiple solder balls 430 are formed under a bottom surface of the printed circuit board 410 to connect the printed circuit board 410 to an external circuitry component (unshown).

As shown in FIG. 3A showing a BGA chip package, after the semiconductor wafer is divided into multiple semiconductor chips, the semiconductor chip 300 with a redistribution metal layer 350 is mounted on a die pad 512 of a lead frame 510. Next, multiple wirebond wires 200 are formed to connect the redistribution metal layer 350 of the semiconductor chip 300 to multiple leads 514 of the lead frame 510. Next, a packaging polymer structure 520 is formed to encapsulate the semiconductor chip 300, the wirebond wires 200 and the die pad 512. Next, the leads 514 of the TSOP chip package's lead frame 510 are bent in a Gull Wing fashion.

The packaging process of the SOJ package illustrated in FIG. 5 is similar to the TSOP packaging process. In contrast to the TSOP packaging process however, the leads 514 of the SOJ package are bent into J-shapes.

The described assembly process has the following advantages:

-   -   1. In comparison to the prior art, the invented chip structure         with a redistribution layer and process for the same do not need         an elastomer layer. That is, the invented structure and its         process allows the direct placement of the bonding wire on the         redistributed connection point that has active devices         underneath; it greatly extends design flexibility.     -   2. The invented chip structure with a redistribution layer can         be used in a number of chip packages that utilize the         wire-bonding process, such as BGA, TSOP, and SOJ packages.     -   3. In comparison to prior arts, the invented process does not         require an additional polymer layer serving as elastomer layer         between redistribution layer and IC passivation layer; thus, the         fabrication of the semiconductor chip 300 is economic and         time-saving.

It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. For example, it is possible that the wire-bonding pad is not electrically connected to the testing pad or to the bump pad. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents. 

1. A semiconductor chip or wafer comprising: a passivation layer comprising an inorganic layer; and a circuit line over and in touch with said inorganic layer of said passivation layer, wherein said circuit line comprises a first contact point connected to only one second contact point exposed by an opening in said passivation layer, and the positions of said first contact point and said only one second contact point from a top view are different, and said first contact point is used to be wirebonded thereto.
 2. The semiconductor chip or wafer of claim 1, wherein said inorganic layer comprises nitride.
 3. The semiconductor chip or wafer of claim 1, wherein said inorganic layer has a thickness of between 0.2 and 1.2 μm.
 4. The semiconductor chip or wafer of claim 1 further comprising a polymer layer over said circuit line, wherein an opening in said polymer layer exposes said first contact point.
 5. The semiconductor chip or wafer of claim 1 further comprising a circuit under said first contact point.
 6. The semiconductor chip or wafer of claim 1 further comprising a MOS device under said first contact point.
 7. The semiconductor chip or wafer of claim 1, wherein said circuit line comprises a metal layer having a thickness greater than 1 μm and comprising gold with greater than
 90. 8. The semiconductor chip or wafer of claim 1, wherein said circuit line comprises a metal layer having a thickness greater than 1 μm and comprising copper with greater than
 90. 9. The semiconductor chip or wafer of claim 1, wherein said circuit line comprises a metal layer having a thickness greater than 1 μm and comprising silver with greater than
 90. 10. The semiconductor chip or wafer of claim 1, wherein said circuit line comprises a metal layer having a thickness greater than 1 μm and comprising platinum with greater than
 90. 11. The semiconductor chip or wafer of claim 1, wherein said circuit line comprises a metal layer having a thickness greater than 1 μm and comprising palladium with greater than
 90. 12. The semiconductor chip or wafer of claim 1, wherein said circuit line comprises a metal layer having a thickness greater than 1 μm and comprising rhodium with greater than
 90. 